Amkor Assembly & Test Shanghai Co., Ltd.
國家: China
公司簡介
Amkor Technology provides outsourced semiconductor packaging and test services in the United States and internationally. The company serves integrated device manufacturers, fabless semiconductor companies, and contract foundries and is headquartered in Tempe, AZ.
- 員工人數
- 10000+
- 產業
- Vehicles & Transportation、Packaging & Printing、Electronics、Tools & Hardware
- 主要產品
- Interconnect,DSMBGA,DPAK (TO-252),S-SWIFT™,SO8-FL,FCBGA,fcCSP,SOD128-FL,MQFP,ePad TSSOP/SOIC/SSOP,SOIC,Wafer Bumping,Stacked CSP,HSON8,TSSOP/MSOP,Optical Sensors,SWIFT®,Chip-on-Chip,D2PAK (TO-263),TOLL,Copper Pillar,Interposer PoP,ePad LQFP/TQFP,2.5D/3D TSV,3D Stacked Die,S-Connect™,TQFP,fcMLF®,SOD123-FL,AiP/AoP,Edge Protection™,CABGA/FBGA,TSON8-FL,LQFP,SSOP/QSOP,PQFN,PowerCSP™,FlipStack® CSP,Package-on-Package,LFPAK56,_Micro_ LeadFrame®,TO-220FP,Flip Chip,PBGA/TEPBGA,PSMC,Amkor Mechanical Samples,MEMS and Sensors,FlipStack ® CSP
- 地址
- 2045 East Innovation CircleGoogle 地圖
貿易洞察
用於查核實際出口能力的海關出貨紀錄。
8,179
出口次數
US$105.05億
出口金額
US$10,504,997,662.032026-07
最近出口
出口趨勢
出口次數出口總額（USD）從 2007-07 到 2026-07，共 229 個月度資料點。
買家地圖
買家表格包含 4 個國家或地區。
正在載入買家地圖…
- 1菲律賓4,561
- 2美國47
- 3印度13
- 4越南10