Amkor Assembly & Test Shanghai Co., Ltd.
国家: China
公司简介
Amkor Technology provides outsourced semiconductor packaging and test services in the United States and internationally. The company serves integrated device manufacturers, fabless semiconductor companies, and contract foundries and is headquartered in Tempe, AZ.
- 员工人数
- 10000+
- 行业
- Vehicles & Transportation、Packaging & Printing、Electronics、Tools & Hardware
- 主营产品
- Interconnect,DSMBGA,DPAK (TO-252),S-SWIFT™,SO8-FL,FCBGA,fcCSP,SOD128-FL,MQFP,ePad TSSOP/SOIC/SSOP,SOIC,Wafer Bumping,Stacked CSP,HSON8,TSSOP/MSOP,Optical Sensors,SWIFT®,Chip-on-Chip,D2PAK (TO-263),TOLL,Copper Pillar,Interposer PoP,ePad LQFP/TQFP,2.5D/3D TSV,3D Stacked Die,S-Connect™,TQFP,fcMLF®,SOD123-FL,AiP/AoP,Edge Protection™,CABGA/FBGA,TSON8-FL,LQFP,SSOP/QSOP,PQFN,PowerCSP™,FlipStack® CSP,Package-on-Package,LFPAK56,_Micro_ LeadFrame®,TO-220FP,Flip Chip,PBGA/TEPBGA,PSMC,Amkor Mechanical Samples,MEMS and Sensors,FlipStack ® CSP
- 地址
- 2045 East Innovation CircleGoogle 地图
贸易洞察
用于核验真实出口能力的海关出货记录。
8,179
出口次数
US$105.05亿
出口金额
US$10,504,997,662.032026-07
最近出口
出口趋势
出口次数出口总额（美元）从 2007-07 到 2026-07，共 229 个月度数据点。
买家地图
买家表格包含 4 个国家或地区。
正在加载买家地图…
- 1菲律宾4,561
- 2美国47
- 3印度13
- 4越南10