Amkor Assembly & Test Shanghai Co., Ltd.
Country: China
About the supplier
Amkor Technology provides outsourced semiconductor packaging and test services in the United States and internationally. The company serves integrated device manufacturers, fabless semiconductor companies, and contract foundries and is headquartered in Tempe, AZ.
- Number of Employees
- 10000+
- Website
- amkor.com
- Industry
- Vehicles & Transportation、Packaging & Printing、Electronics、Tools & Hardware
- Main products
- Interconnect,DSMBGA,DPAK (TO-252),S-SWIFT™,SO8-FL,FCBGA,fcCSP,SOD128-FL,MQFP,ePad TSSOP/SOIC/SSOP,SOIC,Wafer Bumping,Stacked CSP,HSON8,TSSOP/MSOP,Optical Sensors,SWIFT®,Chip-on-Chip,D2PAK (TO-263),TOLL,Copper Pillar,Interposer PoP,ePad LQFP/TQFP,2.5D/3D TSV,3D Stacked Die,S-Connect™,TQFP,fcMLF®,SOD123-FL,AiP/AoP,Edge Protection™,CABGA/FBGA,TSON8-FL,LQFP,SSOP/QSOP,PQFN,PowerCSP™,FlipStack® CSP,Package-on-Package,LFPAK56,_Micro_ LeadFrame®,TO-220FP,Flip Chip,PBGA/TEPBGA,PSMC,Amkor Mechanical Samples,MEMS and Sensors,FlipStack ® CSP
- Address
- 2045 East Innovation CircleGoogle Maps
Trade Intelligence
Customs shipment history used to verify real export capability.
8,179
Export Count
$10.5B
Export Value
$10,504,997,662.032026-07
Last Exports
Export trends
Number of exportsTotal export amount (USD)229 monthly points from 2007-07 through 2026-07.
Buyers Map
Buyer table contains 4 countries or regions.
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- 1Philippines4,561
- 2United States47
- 3India13
- 4Vietnam10